LED production process

1 process:
a) Cleaning: Ultrasonic cleaning PCB or LED bracket, and drying.
b) mountings: the LED die (wafer) on a silver plastic bottom electrode prepared after expansion, the expansion after the die (wafer) placed in the thorn crystal table under the microscope with a thorn crystal pen will die one a stent mounted on a PCB or LED corresponding pads, followed by sintering silver adhesive curing.
c) pressure welding: welding with aluminum or gold electrodes are connected to the LED die, and for current injection leads. LED mounted directly on the PCB, the general use of aluminum wire welder. (TOP-LED needs to make white gold wire bonder)Character LCD Module
d) Package: By dispensing with epoxy the LED die and wire protected. Dispensing the PCB, the shape of the cured gel, there are strict requirements, which is directly related to the backlight brightness of the finished product. This process will also assume point phosphor (white LED) task.
e) Welding: If the backlight is the use of SMD-LED or other encapsulated LED, in the assembly process, you need the LED soldered to the PCB board.
f) cutting film: punch die backlight required various diffusion film, reflective film.
g) Assembly: According to the requirements of the drawings, the backlight of the various materials manually install the correct position.
h) Test: Check the backlight optical parameters and light uniformity is good.
Packing: according to requirements of the finished packaging, warehousing.TFT LCD Display