LCD module production technology

LCD module production technology

SMT
Surface mount technology
That surface mount technology ,custom lcd module which is a more traditional installation. The advantage of high reliability, the disadvantage of large size, high cost , miniaturization limit LCM .
COB
Chip On Board
That chip is bonding (Bonding) on the PCB, due to the LCD controller IC manufacturers and related
Production is reduced on-chip (SMT a ) encapsulation yield QFP, therefore , the conventional SMT system is gradually replaced in future products.
TAB
Tape Aotomated Bonding
Anisotropic conductive adhesive connections. The package in the form of TCP (Tape Carrier
Package tape carrier package) are fixed to the IC and PCB LCD anisotropic conductive adhesive . This installation method can reduce the LCM of weight, volume, easy installation, good reliability !
COG COG LCD Module
Chip On Glass
Chip bonding directly on the glass . This installation method can greatly reduce the volume of the entire LCD module , and easy mass production for consumer electronics products with the LCD, such as: mobile phone , PDA and other portable electronic products. This installation in the IC manufacturer's push connection in the future will be the main IC and LCD .
COF
Chip On Film
Chip is directly mounted on the flexible PCB. A high degree of integration of this connection ,lcm module external components can be mounted on flexible